STATS ChipPAC
Technology Development Trainee
STATS ChipPACSingapore4 days ago
Full-timeEngineering, Design +1

STATS ChipPAC Talent Trainee Program


Program Details

1. Tailored Education Program

  • A global learning environment, including overseas rotational assignments (18–24 months).
  • Professional technical and corporate culture training leveraging STATS ChipPAC’s global network.

2. Learning and Development Support

  • Coaching: Expert coaching to enhance individual competencies.
  • Mentoring: Dedicated mentoring from experienced professionals.
  • Peer Learning: Knowledge sharing and teamwork-driven collaboration.
  • HR Support: Systematic career development and growth opportunities.

3. Practical, Hands-on Learning

  • Collaborate with semiconductor packaging experts through domestic and international assignments.
  • Gain real-world problem-solving experience by participating in diverse team projects.


Eligibility

  • Fields of Study: Semiconductor Packaging, Chemical Engineering, IC, Materials Science, Microelectronics, Mechanical Engineering, Industrial Engineering, Optoelectronics, Physics, Electronics, and other related fields.
  • Academic Requirements: Master’s or Doctoral degree holders (including expected graduates).
  • Additional Qualifications:
  • Willingness to participate in overseas rotational assignments.
  • Strong teamwork and problem-solving skills.
  • Proficiency in global communication (English/Chinese fluency preferred).