R&D Die-to-Wafer bonding step developer

What you will do

Die-to-Wafer (D2W) bonding is a key enabling technology for advanced packaging and heterogeneous integration. It allows the integration of dies from different technology nodes, materials, sizes, and thicknesses. Direct dielectric and hybrid copper/dielectric bonding are increasingly adopted because they enable highly accurate overlay alignment through low-force, room-temperature bonding processes.

As part of the MAterial Transfer (MAT) team, you will contribute to the development and optimization of advanced D2W bonding processes. A significant part of your work will take place in the cleanroom, where you will collaborate closely with R&D engineers to develop, execute, and improve bonding processes.

You will support multiple cutting-edge research programs in areas such as 3D integration, Optical I/O, imagers, memory… You will work in a dynamic, multidisciplinary, and international environment together with researchers, process engineers, equipment suppliers, industrial partners, and device experts.

Responsibilities

As an R&D Process Engineer for D2W bonding, you will play a key role in achieving the team’s technical objectives. Your responsibilities will include:

• Organizing and executing D2W bonding process development activities
• Developing, optimizing, and validating bonding processes using associated metrology techniques (e.g. overlay measurements, void inspection, bond quality analysis)
• Analysing and summarizing experimental results, with a focus on process optimization and performance improvement
• Reporting progress, results, and opportunities to different stakeholders and organizational levels
• Taking an active hands-on role in the cleanroom and contributing to the ownership and maturity of the bonding process flow
• Collaborating across teams, including integration, hardware, operations, and support groups, to enable successful process development
  
  

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Who you are

• You hold a Master’s degree in Physics, Chemistry, Materials Science, Engineering, or a related field.
• You enjoy working in a collaborative team environment while also being able to work independently when needed
• You are motivated to work in a highly innovative and international R&D environment
• You are fluent in written and spoken English
• You are eager to work hands-on in a semiconductor cleanroom environment
• Experience with bonding, plasma, CMP or cleaning processes is considered an advantage
• Experience with data analysis, simulation, or modelling tools (e.g. Python, MATLAB, C/C++, COMSOL) is a plus
• Experience with bonding-related metrology techniques is a plus
• You are analytical, solution-oriented, and passionate about process development and data interpretation
• You work in a structured, organized, and methodical way
  
  

IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.