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European Tech Recruit

Embedded Software Engineer

European Tech Recruit
Germany · Contract · Mid-Senior

Embedded Software Engineer - III - Semiconductor, Hybrid - up to 80% remote possible (Dresden, Germany) - 12 months contract


Job Description:

Join the team contributing to the Digital Broadcast Radio, focusing on the Physical Layer implementation. This role involves working with OFDM signal processing and implementing algorithms on Digital Signal Processors (DSPs). You will work closely with existing firmware modules, integrate and optimize DSP code, and ensure high performance and quality standards.


Key Responsibilities:

  • Integrate existing firmware modules into the testing environment.
  • Model signal processing algorithms in Matlab based on algorithm specifications or existing code.
  • Implement and optimize DSP code for the current generation of DSPs.
  • Set up and run reference tests, analyze deviations, and make corrections as needed.
  • Evaluate and improve MIPS and memory usage of modules.
  • Debug and integrate modules within the digital radio signal chain.
  • Ensure all modules meet the quality standards and adhere to processes.


Essential Skills:

  • Master’s degree in Electronic Engineering or Computer Science with 5-10 years of experience in embedded software development.
  • Strong experience in DSP programming (C/C++ and assembly).
  • Familiarity with OFDM signal processing.
  • Experience with embedded development toolchains, debugging tools, and version control systems.
  • Proficient with software debugging tools (debuggers, logic analyzers, oscilloscopes).


Preferred Skills:

  • Prototyping new features and algorithms in Matlab or equivalent environments.
  • Experience in the RF domain and knowledge of PHY layer standards based on OFDM.
  • Agile software development experience.
  • Familiarity with Atlassian tools (JIRA, Bitbucket).
  • Awareness of quality standards like CMMI and IATF 16949.


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Key Skills

Ranked by relevance

dsp embedded c assembly jira
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Posted
Nov 01, 2024
Type
Contract
Level
Mid-Senior
Location
Dresden

Industries

Semiconductor Manufacturing

Categories

Engineering

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